A SILICONE PAD IS MOLDED TO AN ALUMINUM DIE

A SILICONE PAD IS MOLDED TO AN ALUMINUM DIE THAT IS CONNECTED TO A BASE. THAT BASE IS FASTENED TO AN ALUMINUM BLOCK WITH A HEATING ELEMENT IN THE CENTER THAT CAN PRODUCE QGEN MAXIMUM OF 700 W. THE ALUMINUM HEATING ELEMENT BLOCK IS CONNECTED TO A STAINLESS STEEL SUPPORT STRUCTURE THAT ACTS AS A HEAT SINK. WHAT IS THE OPTIMAL THERMAL CONDUCTIVITY OF SILICONE PAD? HOW LONG DOES IT TAKE THE ALUMINUM SYSTEM TO GET TO STEAD-STATE? HOW LONG DOES IT TAKE FOR THE SILICONE PAD TO REACH STEADY-STATE? THE PAD NEEDS MAKES CONTACT WITH A POLYESTER SUBSTRATE (HEAT SINK ) OF SAME AREA AND MUST REMAIN IN CONTACT FOR 30 SECONDS. ASSUMING HEAT TRANSFER TO POLYESTER IS PURE CONDUCTION, WILL THE HEAT TRANSFER BE SUFFICIENT TO EXPOSE THE SUBSTRATE TO A CONSTANT 118 C IN ORDER TO CURE? IF NOT, WHAT NEEDS TO BE CHANGED AND HOW?


 

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